IGBT cooling device

Choosing an IGBT module heatsink involves considering two main factors as prerequisites:

1. Thermal resistance: Thermal resistance is an important indicator of the cooling capacity of the heatsink. The key aspect of the thermal design of an IGBT heat pipe heatsink is calculating the thermal resistance of the heatsink. When choosing a heatsink, first determine the cooling method based on the power consumption of the component. The range for this parameter can be determined by referring to the following chart to select a high-power heat pipe heatsink.

   2. Cooling method: The cooling method can ensure the stability of thermal resistance. The choice of method depends on factors such as structure, operational reliability, and cost. Each method has its advantages and disadvantages. The chart below uses power consumption as a parameter, and the range can be determined by referring to it.

  Characteristics of Air-Cooled Heatsinks for IGBT Modules

    Air-cooled heatsinks are characterized by high cooling efficiency, low cost, high reliability, simple structure, and easy maintenance. Traditional air-cooled heatsinks have been limited by the manufacturing process, molds, and machining capabilities, which has hindered significant advancements in cooling capacity. As a result, their application has been restricted to situations with lower cooling power requirements and larger cooling spaces. Nevertheless, air-cooled heatsinks are widely and commonly used in power electronic devices.

    With the rapid development of power electronics technology and the increasing demand for high performance, high reliability, and high power components in modern electronic equipment, the degree of heat dissipation per unit volume has significantly increased, leading to a sharp rise in heat generation and temperature. The issues caused by thermal stress, including mechanical, chemical, and electrical problems, are becoming increasingly severe, severely affecting product quality and reliability. Therefore, the cooling of high-power components (IGBT modules) has become a focal point of concern in the field of power electronics applications.